Terms and Conditions: By using this invention submission form/website, you agree that you are the owner of the invention and authorized to submit this request. You acknowledge that the disclosure is being made on a NON CONFIDENTIAL basis, and that no obligations or legal relationship are created by this submission.
You acknowledge that the panel is provided for the purpose of feedback and advice. This is an opportunity to pitch and not a guarantee of a on the spot offer/deal.
You understand that by exhibiting and pitching on a panel you are making a public disclosure of your invention and should consider your intellectual property protection prior to participating.