• Travel Support Application

    Submission deadline: January 25, 2027
  • Applicant Information

  • Address

  • Study Information

  • Type of Degree (Ph.D. or equivalent, or M.S.)*
  • Thesis Information

  • Advisor Information

  • Conference Presentation Information

  • Are you an author on a digest(s) at the conference?*
  • Are you presenting a digest at the conference?*
  • Travel Expense Budget Information

  • Previous Travel Awards

  • Have you received a travel award for a previous IEEE Magnetics Society sponsored Conference? (e.g. Intermag, MMM, TMRC)*
  • I agree to write a brief account of my experiences at the conference for possible inclusion in the IEEE Magnetics Society newsletter.*
  • Should be Empty: