Application Form for Malaysia Semiconductor IC Design Park Logo
  • Application Form for Malaysia Semiconductor IC Design Park

    Section 1: Applicant Details
  • Section 2: Financial Information

  • Section 3: Business Information

  • Section 4: Declaration

  • Section 5: Submission Documents and Templates

    Please ensure that this application form is submitted together with all supporting documents and the completed document checklist. All documents must be duly verified by the company’s authorised personnel or certified as true copies by an authorised party. Kindly upload all supporting materials, including the document checklist, into a single folder and share the folder link via a cloud storage platform such as Google Drive or OneDrive. Additionally, please make a copy of the required templates for submission - namely the NDA, Letter of Intent, and Business Proposal - which can be accessed here: https://terabox.com/s/1mpHewQBr4Xfx8v360DkF2g
  • Should be Empty: